Burn-in socket with a heat sink

ABSTRACT

An burn-in socket electrically connecting an IC package to a PCB, comprises a base, a cover, a plurality of contacts and a block-shaped heat sink. The base defines a receiving space for the IC package. The cover is pin-jointed to one side by a pivot of the base and able to rotate around the pivot. A plurality of contacts are retained in the base and partially exposed in the receiving space. The heat sink is located above the IC package and against to the IC package so as to apply its gravity force to the IC package. Top face of the heat sink is below top face of the cover.

FIELD OF THE INVENTION

The present invention generally relates to an electrical connectorelectrically connecting an IC (integrated circuit) package to PCB(printed circuit board).

DESCRIPTION OF RELATED ART

IC package is widely used in computing field. Each IC package should betested for stability and security. High-temperature test in a bum-insocket is one among these testing processes. Of course, the IC packagealso need be cooled in the high-temperature environment to avoid beingburnt out. A water-cooled machine is usually located at the top of theburin-in socket to transport heat from the IC package. But as we know,the IC package is supported by electrical contacts that are elastic. Thegravity is not able to provide enough force for the electricalconnection between the bum-in socket and the IC package.

In view of the foregoing, an electrical connector with a retentionelement is provided.

SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to provide anelectrical connector a retention element also used for heat radiation.

In order to achieve the object set forth, an bum-in socket electricallyconnecting an IC package to a PCB, comprises a base, a cover, aplurality of contacts and a block-shaped heat sink. The base defines areceiving space for the IC package. The cover is pin-jointed to one sideby a pivot of the base and able to rotate around the pivot. A pluralityof contacts are retained in the base and partially exposed in thereceiving space. The heat sink is located above the IC package andagainst to the IC package so as to apply its gravity force to the ICpackage. Top face of the heat sink is below top face of the cover.

Other objects, advantages and novel features of the invention willbecome more apparent from the following detailed description when takenin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of a burn-in socket in accordance with thepresent invention;

FIG. 2 is an exploded view from another direction of the burn-in socketshown in FIG. 1;

FIG. 3 is an exploded view of the first cover with a heat sink of theburn-in socket shown in FIG. 1;

FIG. 4 is another view of a the first cover with a heat sink shown inFIG. 3;

FIG. 5 is a perspective view of heat sink retained on the first cover;

FIG. 6 is an perspective view of the burn-in socket with an IC package;and

FIG 7. is a cross-sectional view along a line A-A of the burn-in socketwith an IC package shown in FIG. 6.

DETAILED DESCRIPTION OF THE INVENTION

Reference will now be made in detail to the preferred embodiment of thepresent invention.

Referring to FIG. 1 to FIG. 7, a burn-in socket 100 is used toelectrically connect an IC package 2000 to a PCB (not shown). Theburn-in socket comprises a base 100 and a cover 200 pin jointer onopposite sides of the base. The cover defines a depression 201 runningthrough the bottom thereof A heat sink is fixed in the depression 201.

Referring to FIGS. 1-2, the base is shaped as a cuboid and defines areceiving space 101 connecting the depression 201. The IC package isretained in the receiving space 101. A plurality of contacts 102 arepartially exposed to the receiving space. The has are assembled with twopivots 103, 104 at opposite sides of the base. The two pivots aredisposed parallel to each other.

The cover further comprises a first cover 210 (or a lower cover) and asecond cover 220 (or an upper cover). The first cover 210 is pin-jointedto a first pivot 103 on a first side while the second cover 220 ispin-jointed to a second pivot 104 on a second opposite side. The firstcover 210 is also pivot-connected to the second cover 220 by a thirdpivot (not numbered, best shown in FIG. 1).

Combining FIGS. 3-5, the first cover 201 comprises a fixed element 212exposed both the bottom face and top face thereof. The fixed element 212defines a retaining space 2120 and an opening 2121 downward. The heatsink is block-shaped and stuffed. The heat sink is received in theretaining space 2120.

The heat sink comprises a main portion 2111 and several supportingportions 2111 extending from the main portion. The shape of theretaining space 2120 is just suit for of the heat sink 211. The heatsink defines a bottom face 2110 protruding from the opening 2121 of thefixed element. The first cover also defines a pressing face 202 (or thebottom face) aligned with the bottom face 2110 of the heat sink. Theheat sink 211 and the fixed element are against to the IC package andretain the IC package by this means (best shown in FIG. 7). Thesupporting portions each comprises a hole 2112 corresponding to aretaining hole 2122 set on the fixed element 212. Several pins 214 areretained in the holes and hold the heat sink and the fixed element.

The second cover comprises a pair of latches 230 with barbs locking incorresponding recesses 105 (best shown in FIG. 1) defined on the base100. The assembling process is as follows. First, the heat sink ispositioned in the retaining space 2120 and the pins 214 are insertedinto the retaining holes 2122 and holes 2112. And then lay the ICpackage 1000 into the receiving space. The third step is to rotate thesecond cover 220. The second cover 220 drives the first cover 210 untilthe first and second covers parallel to top face of the base 100. At thesame time, the bottom face 2110 presses against to the IC package 2000to provide enough retaining force by gravity force, which guarantee abetter electrical connection. A top face of the heat sink 211 is below atop face of the cover 200 so as to lower height of the whole electricalsystem.

It is to be understood, however, that even though numerouscharacteristics and advantages of the present invention have been setforth in the foregoing description, together with details of thestructure and function of the invention, the disclosure is illustratedonly, and changes may be made in detail, especially in matters of shape,size, and arrangement of parts within the principles of the invention tothe full extent indicated by the broad general meaning of the terms inwhich the appended claims are expressed.

We claim:
 1. A bum-in socket electrically connecting an IC package to aPCB, comprising: a base defining a receiving space for the IC package; acover pin-jointed to one side by a pivot of the base and able to rotatearound the pivot; a plurality of contacts retained in the base andpartially exposed to the receiving space; a block-shaped heat sinklocated above the IC package and abutting against the IC package so asto apply a gravity force to the IC package; wherein top face of the heatsink is below a top face of the cover.
 2. The electrical connector asclaimed in claim 1, wherein the heat sink is made of metal of greatconductivity for efficient heat conduction.
 3. The electrical connectoras claimed in claim 2, wherein the cover defines a pressing faceabutting against the IC package and aligned with a bottom surface of theheat sink.
 4. The electrical connector as claimed in claim 1, whereinthe cover comprises a fixed element defining a retaining space to holdthe heat sink, the heat sink is able to rotate around the pivot togetherwith the cover.
 5. The electrical connector as claimed in claim 4,wherein the heat sink comprises a main portion and several supportingportions adapting for the retaining space.
 6. The electrical connectoras claimed in claim 1, wherein the cover comprises an upper cover and alower one cover pin-jointed opposite sides of the base, the upper oneand the lower one rotate relatively.
 7. A bum-in socket electricallyconnecting an IC package to a PCB and defining a first side and a secondside opposite to the first side, comprising: a base defining a receivingspace with a plurality of contacts received in the receiving space ; afirst cover pin-jointed at the first side of the base; a second coverpin-jointed to the first cover and latching with the base an the secondside; a heat sink made of metal and retained in the first cover; whereinthe heat sink is supported by the IC package when the second coverrotates to a position that parallel to the IC package.
 8. A socketassembly comprising: a base defining a receiving cavity between twoopposite first and second ends of said base; an electronic packagereceived in the receiving cavity; a plurality of contacts disposed inthe base and upwardly electrically and mechanically connecting with theelectronic package; a cover having a first portion pivotally mountedwith the first end of the base and a second portion opposite to saidfirst portion and swinging between open and locked positions toreleasably locked to the second end of the base so as to hold theelectronic package in position; a heat sink secured to the cover toapply a downward force upon the electronic package when said cover ismoved to the locked position.
 9. The socket assembly as claimed in claim8, wherein said cover includes a lower part and an upper part pivotallyassembled to each other.
 10. The socket assembly as claimed in claim 9,wherein said heat sink is secured to the lower part.
 11. The socketassembly as claimed in claim 10, wherein the lower part includes a frameand a fixing element therein to commonly secure the heat sink inposition.
 12. The socket assembly as claimed in claim 11, wherein thefixing element defines an opening in compliance with a contour of theheat sink to compliantly and supportably receive the heat sink thereinwhile the frame secures the heat sink via a pin extending therethroughin a transverse direction.
 13. The socket assembly as claimed in claim12, wherein the fixing element is secured to the frame via a pluralityof pins extending transversely through the frame.
 14. The socketassembly as claimed in claim 12, wherein the heat sink is fixed to theframe in a vertically floatable manner for compliance with theelectronic package.
 15. The socket assembly as claimed in claim 9,wherein said lower part and said upper part are pivotally assembled toeach other around the second portion.
 16. The socket assembly as claimedin claim 15, wherein the upper part includes a first hook around saidsecond portion to lock to the base for securing said cover in the lockedposition with regard to the base.
 17. The socket assembly as claimed inclaim 16, wherein the upper part further includes a second hook aroundthe first portion to lock to the base so as to prevent the first hookfrom leaving the base.